Lead-Free Solder Interconnect Reliability

Lead-Free Solder Interconnect Reliability
Author :
Publisher : ASM International
Total Pages : 292
Release :
ISBN-10 : 9781615030934
ISBN-13 : 161503093X
Rating : 4/5 (93X Downloads)
DOWNLOAD EBOOK
Book Synopsis Lead-Free Solder Interconnect Reliability by : Dongkai Shangguan

Download or read book Lead-Free Solder Interconnect Reliability written by Dongkai Shangguan and published by ASM International. This book was released on 2005 with total page 292 pages. Available in PDF, EPUB and Kindle. Book excerpt:


Lead-Free Solder Interconnect Reliability Related Books

Lead-Free Solder Interconnect Reliability
Language: en
Pages: 292

Lead-Free Solder Interconnect Reliability

Authors: Dongkai Shangguan
Categories: Technology & Engineering
Type: BOOK - Published: 2005 - Publisher: ASM International

DOWNLOAD EBOOK

Fundamentals of Lead-Free Solder Interconnect Technology
Language: en
Pages: 266

Fundamentals of Lead-Free Solder Interconnect Technology

Authors: Tae-Kyu Lee
Categories: Technology & Engineering
Type: BOOK - Published: 2014-11-05 - Publisher: Springer

DOWNLOAD EBOOK

This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mech
Assembly and Reliability of Lead-Free Solder Joints
Language: en
Pages: 545

Assembly and Reliability of Lead-Free Solder Joints

Authors: John H. Lau
Categories: Technology & Engineering
Type: BOOK - Published: 2020-05-29 - Publisher: Springer Nature

DOWNLOAD EBOOK

This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight place
Solder Joint Reliability
Language: en
Pages: 649

Solder Joint Reliability

Authors: John H. Lau
Categories: Technology & Engineering
Type: BOOK - Published: 2013-11-27 - Publisher: Springer Science & Business Media

DOWNLOAD EBOOK

Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components.
Advanced Manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging
Language: en
Pages: 72

Advanced Manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging

Authors:
Categories: Electronic packaging
Type: BOOK - Published: 2006 - Publisher: Emerald Group Publishing

DOWNLOAD EBOOK

This issue of Soldering & Surface Mount Technology (SSMT) presents a number of papers from the 7th High Density Microsystems Design, Packaging and Failure Analy