Thermal Stress and Fatigue Analysis of Microelectronic Packaging
| Author | : Meng Leong Tan |
| Publisher | : |
| Total Pages | : |
| Release | : 1998 |
| ISBN-10 | : OCLC:68882781 |
| ISBN-13 | : |
| Rating | : 4/5 ( Downloads) |
Book Synopsis Thermal Stress and Fatigue Analysis of Microelectronic Packaging by : Meng Leong Tan
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