Modeling, Design, and Fabrication of Carbon Nanostructures for Next-generation Integrated Circuit Interconnects and Passive Devices

Download or read book Modeling, Design, and Fabrication of Carbon Nanostructures for Next-generation Integrated Circuit Interconnects and Passive Devices written by Hong Li and published by . This book was released on 2012 with total page 230 pages. Available in PDF, EPUB and Kindle. Book excerpt: The semiconductor industry is confronting an acute problem in the interconnect area--as IC feature sizes continue to be scaled below 22 nm, Cu wires exhibit significant "size effects" resulting in a sharp rise in their resistivity, which in turn has adverse impact both on IC performance and reliability.