Advanced Interconnects and Contact Materials and Processes for Future Integrated Circuits: Volume 514

Download or read book Advanced Interconnects and Contact Materials and Processes for Future Integrated Circuits: Volume 514 written by S. P. Murarka and published by . This book was released on 1998-11-02 with total page 596 pages. Available in PDF, EPUB and Kindle. Book excerpt: Comprising the proceedings of an MRS symposium held in April of 1998, contributions in this volume are divided into ten sections: interconnection frontiers; aluminum interconnects; cobalt and other silicides; titanium silicide; MOSFET, source, drain, and interconnect engineering; copper interconnects and barriers; a poster session on advanced interconnects and contacts; contacts to compound semiconductor devices; novel interconnect materials and schemes; and diffusion barriers. Annotation copyrighted by Book News, Inc., Portland, OR