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Language: en
Pages: 397
Pages: 397
Type: BOOK - Published: 2017-12-19 - Publisher: CRC Press
Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3
Language: en
Pages: 770
Pages: 770
Type: BOOK - Published: 2017-07-04 - Publisher: Newnes
Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in cir
Language: en
Pages: 573
Pages: 573
Type: BOOK - Published: 2012-11-27 - Publisher: Springer Science & Business Media
This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimension
Language: en
Pages: 655
Pages: 655
Type: BOOK - Published: 2019-01-25 - Publisher: John Wiley & Sons
This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and mate
Language: en
Pages: 674
Pages: 674
Type: BOOK - Published: 2019-12-13 - Publisher: IGI Global
As today’s world continues to advance, Artificial Intelligence (AI) is a field that has become a staple of technological development and led to the advancemen