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Multi-Chip Module Test Strategies
Language: en
Pages: 161
Authors: Yervant Zorian
Categories: Technology & Engineering
Type: BOOK - Published: 2012-12-06 - Publisher: Springer Science & Business Media

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MCMs today consist of complex and dense VLSI devices mounted into packages that allow little physical access to internal nodes. The complexity and cost associat
Multichip Module Technologies and Alternatives: The Basics
Language: en
Pages: 895
Authors: Daryl Ann Doane
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Type: BOOK - Published: 2013-11-27 - Publisher: Springer Science & Business Media

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Far from being the passive containers for semiconductor devices of the past, the packages in today's high performance computers pose numerous challenges in inte
Integrated Circuit Manufacturability
Language: en
Pages: 338
Authors: José Pineda de Gyvez
Categories: Technology & Engineering
Type: BOOK - Published: 1998-10-30 - Publisher: John Wiley & Sons

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"INTEGRATED CIRCUIT MANUFACTURABILITY provides comprehensive coverage of the process and design variables that determine the ease and feasibility of fabrication
Program Information Package for Defense Technology Conversion, Reinvestment, and Transition Assistance
Language: en
Pages: 132
Authors: Advanced Research Projects Agency Staff
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Addresses defense industry and technology base activities under eight separate statutory authority programs and sets forth planned selection criteria by which p
Multichip Module Technology Handbook
Language: en
Pages: 696
Authors: Philip E. Garrou
Categories: Technology & Engineering
Type: BOOK - Published: 1998 - Publisher: McGraw-Hill Professional Publishing

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MCMs are electronic components that house multiple integrated circuits (ICs) upon a single chip. Their use in design allow systems that are faster, hotter and m