Related Books

Journal of Electronic Packaging
Language: en
Pages: 184
Authors:
Categories: Electronic packaging
Type: BOOK - Published: 2004 - Publisher:

DOWNLOAD EBOOK

Area Array Interconnection Handbook
Language: en
Pages: 1250
Authors: Karl J. Puttlitz
Categories: Technology & Engineering
Type: BOOK - Published: 2012-12-06 - Publisher: Springer Science & Business Media

DOWNLOAD EBOOK

Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third
Solder Joint Reliability
Language: en
Pages: 649
Authors: John H. Lau
Categories: Technology & Engineering
Type: BOOK - Published: 2013-11-27 - Publisher: Springer Science & Business Media

DOWNLOAD EBOOK

Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components.
Texas Instruments Technical Journal
Language: en
Pages: 778
Authors:
Categories: Computer engineering
Type: BOOK - Published: 1996 - Publisher:

DOWNLOAD EBOOK

Reflow Soldering Processes
Language: en
Pages: 282
Authors: Ning-Cheng Lee
Categories: Technology & Engineering
Type: BOOK - Published: 2002-01-11 - Publisher: Newnes

DOWNLOAD EBOOK

Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its i