Processing, Reliability, and Integration Issues in Chemical Mechanical Planarization

Download or read book Processing, Reliability, and Integration Issues in Chemical Mechanical Planarization written by Parshuram B. Zantye and published by . This book was released on 2005 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: ABSTRACT: Global planarization is one of the major demands of the semiconductor industry. Chemical mechanical polishing (CMP) is the planarization method of choice use to achieve the required stringent tolerances essential for successful fabrication of next generation Integrated Circuits (IC). The predominant reason for CMP defects is the shear and normal stresses during polishing to which the material is subjected. Understanding the process of CMP and factor that contribute to overall stress addition during polishing requires an approach that encompasses all the four major categories of variables, namely: a) machine parameters, b) material properties, c) polishing pad characteristics, and d) polishing slurry performance.