Predicting Solder Defects in Printed Circuit Board Assembly (PCBA) Process

Predicting Solder Defects in Printed Circuit Board Assembly (PCBA) Process
Author :
Publisher :
Total Pages : 76
Release :
ISBN-10 : OCLC:1119391584
ISBN-13 :
Rating : 4/5 ( Downloads)

Book Synopsis Predicting Solder Defects in Printed Circuit Board Assembly (PCBA) Process by : Andrew Wallace Foster

Download or read book Predicting Solder Defects in Printed Circuit Board Assembly (PCBA) Process written by Andrew Wallace Foster and published by . This book was released on 2019 with total page 76 pages. Available in PDF, EPUB and Kindle. Book excerpt: Printed circuit boards (PCBs) are core components of virtually every modern electronic device, from smartphones to servers. Accordingly, printed circuit board assembly (PCBA) has become core to Flex, a leading electronics manufacturing services (EMS) company. As the EMS industry continues to automate the PCBA process, it captures more data and creates opportunities to leverage this data and to generate value through analytics. One such promising opportunity is using defect prediction to improve downstream yields. For instance, x-ray inspection, which mostly detects solder defects, has a yield of about 97% for one of Flex's automated PCBA lines, and an improvement even to just 98% would create significant cost savings. Given this opportunity, this project aims to use the new data captured by the first steps in the automated PCBA process to predict solder defects that are usually identified during inspection, several days after the board begins the PCBA process. Specifically, the proposed boosted trees model uses data on 20,000 solder pads to predict whether an entire board will fail a downstream x-ray test. Other, more granular models are also studied, as well as other predictive models such as logistic regression and convolutional neural network models. The model is able to identify defective PCBs with an AUC of 0.74 and improve x-ray inspection yields from 97% to 98%, using one PCBA line at Flex as a case study. A second additional use case would reduce the number of x-ray inspection machines needed. Furthermore, a pilot implementation demonstrated that the model works well enough to enable these savings to be realized in practice. At the site where this study was conducted, these two use cases are estimated to produce significant savings over the seven-year useful life of the PCBA machinery. Since Flex has over 1,500 PCBA sites, the results of this case study suggest that there is potential to scale these analytics and related savings across the company.


Predicting Solder Defects in Printed Circuit Board Assembly (PCBA) Process Related Books

Predicting Solder Defects in Printed Circuit Board Assembly (PCBA) Process
Language: en
Pages: 76
Authors: Andrew Wallace Foster
Categories:
Type: BOOK - Published: 2019 - Publisher:

DOWNLOAD EBOOK

Printed circuit boards (PCBs) are core components of virtually every modern electronic device, from smartphones to servers. Accordingly, printed circuit board a
Solder Joint Reliability
Language: en
Pages: 649
Authors: John H. Lau
Categories: Technology & Engineering
Type: BOOK - Published: 2013-11-27 - Publisher: Springer Science & Business Media

DOWNLOAD EBOOK

Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components.
Effects of Solder Paste Volume on PCBA Assembly Yield and Reliability
Language: en
Pages: 184
Authors: Sai Srinivas Sriperumbudur
Categories: Printed circuits
Type: BOOK - Published: 2016 - Publisher:

DOWNLOAD EBOOK

"Solder paste printing is the most common method for attaching surface mount devices to printed circuit boards and it has been reported that a majority of all a
The Printed Circuit Assembler's Guide To... Solder Defects
Language: en
Pages:
Authors: Indium Corporation
Categories:
Type: BOOK - Published: 2021-11-12 - Publisher:

DOWNLOAD EBOOK

Solder defects in surface-mount technology (SMT) assembly have been an issue for decades. Further, the combined challenges of Pb-free soldering and ever-increas
Quality Assessment of Printed Circuit Boards
Language: en
Pages: 544
Authors: Preben Lund
Categories: Technology
Type: BOOK - Published: 1985 - Publisher:

DOWNLOAD EBOOK