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Language: en
Pages: 484
Pages: 484
Type: BOOK - Published: 2014-04-22 - Publisher: John Wiley & Sons
Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate d
Language: en
Pages: 484
Pages: 484
Type: BOOK - Published: 2014-07-21 - Publisher: John Wiley & Sons
Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate d
Language: en
Pages: 492
Pages: 492
Type: BOOK - Published: 2019-01-25 - Publisher: John Wiley & Sons
This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and mate
Language: en
Pages: 798
Pages: 798
Type: BOOK - Published: 2011-09-22 - Publisher: John Wiley & Sons
The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the r
Language: en
Pages: 374
Pages: 374
Type: BOOK - Published: 2013-08-12 - Publisher: John Wiley & Sons
Closes the gap between hardcore-theoretical and purely experimental RF-MEMS books. The book covers, from a practical viewpoint, the most critical steps that hav