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Language: en
Pages: 5126
Pages: 5126
Type: BOOK - Published: 2015 - Publisher:
Language: en
Pages: 650
Pages: 650
Type: BOOK - Published: 2021-09-10 - Publisher: Woodhead Publishing
Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, hi
Language: en
Pages: 444
Pages: 444
Type: BOOK - Published: 2004-01-26 - Publisher: Springer Science & Business Media
This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor te
Language: en
Pages:
Pages:
Type: BOOK - Published: 2005 - Publisher:
ABSTRACT: Global planarization is one of the major demands of the semiconductor industry. Chemical mechanical polishing (CMP) is the planarization method of cho
Language: en
Pages: 91
Pages: 91
Type: BOOK - Published: 2008-05 - Publisher: The Electrochemical Society
The papers included in this issue of ECS Transactions were originally presented in the symposium ¿Chemical Mechanical Polishing 9¿, held during the 213th meet