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Advances in Chemical Mechanical Planarization (CMP)
Language: en
Pages: 650
Authors: Babu Suryadevara
Categories: Technology & Engineering
Type: BOOK - Published: 2021-09-10 - Publisher: Woodhead Publishing

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Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, hi
Advances and Challenges in Chemical Mechanical Planarization: Volume 991
Language: en
Pages: 0
Authors: Gerfried Zwicker
Categories: Technology & Engineering
Type: BOOK - Published: 2007-11-13 - Publisher: Cambridge University Press

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Chemical mechanical planarization (CMP) has been a leading-edge technology in semiconductor processing for the past 15−20 years. A successful CMP process is b
Advances in Abrasive Based Machining and Finishing Processes
Language: en
Pages: 282
Authors: S. Das
Categories: Technology & Engineering
Type: BOOK - Published: 2020-05-10 - Publisher: Springer Nature

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This book presents the advances in abrasive based machining and finishing in broad sense. Specifically, the book covers the novel machining and finishing strate
Advances in CMP Polishing Technologies
Language: en
Pages: 330
Authors: Toshiro Doi
Categories: Science
Type: BOOK - Published: 2011-12-06 - Publisher: William Andrew

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CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing
Chemical-Mechanical Planarization of Semiconductor Materials
Language: en
Pages: 444
Authors: M.R. Oliver
Categories: Technology & Engineering
Type: BOOK - Published: 2004-01-26 - Publisher: Springer Science & Business Media

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This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor te